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AssigneeThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration
InventorRuth H. Pater
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A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-15082) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.
A tough, processable semi-interpenetrating polymer network prepared by reacting an uncrosslinked, acetylene-terminated thermosetting polyimide prepolymer with a mixture of monomer precursors of a linear thermoplastic polyimide.
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