Resin compositions and a method of curing the same
AssigneeKansai Paint Co., Ltd.
InventorsNoboru Nakai, Osamu Isozaki, Naozumi Iwasawa
Life of this patent
Estimating the term…
Abstract
A resin composition comprising a) a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 3,000 to 200,000; b) a silane compound having an average of 1 or more alkoxysilane, silanol and acyloxysilane groups per molecule and having a number average molecular weight of 104 to 200,000; and c) a metal chelate compound, is curable at a relatively low temperature to yield a film having excellent resistance to weathering.
Claims2
A resin composition comprising 5 to 95 weight percent of (H), a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 3,000 to 200,000;
- 95 to 5 weight percent of (C), a silane compound containing an average of 1 or more functional groups selected from the group consisting of alkoxysilane, silanol and acyloxysilane groups and having a number average molecular weight of 104 to 200,000;
- and 0.01 to 10 parts by weight of (D), at least one metal chelate compound selected from the group consisting of aluminum chelate compounds, titanium chelate compounds and zirconium chelate compounds per 100 parts by weight of the combined weights of (H) and (C).
Dependencies are inferred from the claim text.