Photoresist composition
AssigneeInternational Business Machines Corporation
InventorsGregory Breyta, Christopher J. Knors, Hiroshi Ito, Ratnam Sooriyakumaran
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Abstract
The present invention relates to an improved chemically amplified photoresist composition comprising (i) a photosensitive acid generator and (ii) a polymer comprising the reaction product of hydroxystyrene with acrylate, methacrylate or a mixture of acrylate and methacrylate.
Claims9
A photosensitive resist composition comprising (i) a photosensitive acid generator which is thermally stable to a temperature greater than 160.degree. C. and (ii) a polymer comprising hydroxystyrene and acrylate, methacrylate or a mixture of acrylate and methacrylate, the acrylate and methacrylate, each having an ester group which is an acid labile group which inhibits dissolution.
A photosensitive resist composition comprising (i)
- N-camphorsulfonyloxynaphthalimide and (ii) poly(4-hydroxystyrene-co-t-butylacrylate).
A photosensitive resist composition comprising (i) a photosensitive acid generator which is thermally stable to a temperature greater than 160.degree. C. and (ii) a polymer comprising hydroxystyrene and a monomer selected from acrylate or methacrylate each having an acid labile ester group which inhibits dissolution.
Dependencies are inferred from the claim text.