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US 5,492,586 AGranted
Method for fabricating encased molded multi-chip module substrate
AssigneeMartin Marietta Corporation
InventorThomas B. Gorczyca
Life of this patent
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Abstract
A method for fabricating a multi-chip module substrate comprises providing a carrier having a well. Substrate molding material is poured into the carrier well. A plurality of chips is situated in the substrate molding material. A laminatable dielectric layer is laminated over the substrate molding material at a predetermined temperature and a predetermined pressure so that the substrate molding material flows and encapsulates the chips.
Claims16
A method for fabricating a multi-chip module substrate, comprising the steps of:
- providing a carrier having a carrier well therein;
- providing substrate molding material in the carrier well;
- applying a protective coating over the substrate molding material;
- forming a layer of metal over the protective coating patterned so as to leave holes extending through the metal layer to the protective coating;
- situating a plurality of circuit chips, by placing at least one of said plurality of chips in a predetermined one of said holes of said layer of metal in said protective coating and through a surface of the molding material, each chip having a plurality of chip pads which face away from the away from the substrate molding material;
- and
- laminating a laminatable dielectric layer over the substrate molding material at a predetermined temperature and a predetermined pressure so that the substrate molding material flows and encapsulates at least one of the plurality of chips, and with the protective coating blending with the substrate molding material.
4 more elements
A method for fabricating a multi-chip module substrate, comprising the steps of:
- providing a carrier having a carrier well therein;
- providing a first layer of a dielectric material in the carrier well;
- providing a quantity of a substrate molding material in a well of the dielectric layer located in the carrier well;
- situating a plurality of integrated circuit chips, each with at least one chip pad, in the substrate molding material, with the chip pad facing away from the molding material;
- and
- laminating another dielectric layer to the first layer and over the substrate molding material and the plurality of circuit chips, at a predetermined temperature and a predetermined pressure so that the substrate molding material, now encapsulated between the first and another layers, flows and encapsulates at least one of the plurality of chips.
3 more elements
Dependencies are inferred from the claim text.