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AssigneeDelco Electronics Corporation
InventorsMark E. Webster, John A. Hearn, Daniel R. Bellus, Steven M. Stansberry, Steven A. Middleton, Ronald D. Myer, Gregory L. Hall
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A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.
A method for wire bonding an aluminum wire to a surface of an electrical lead, said method comprising the steps of:
A method for wire bonding an aluminum wire to a lead of an electronics package so as to electrically interconnect said electronics package with a conductor of an electronics circuit, said method comprising the steps of:
Dependencies are inferred from the claim text.