Method of making a test probe ring
AssigneeProbes Associates, Inc.
InventorGeorge L. Isaac
Life of this patent
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Abstract
A test probe ring for semiconductor devices is disclosed which contains a ground plane layer, an insulating layer and a layer of electrically separate conductors. A centrally located opening in the layered assembly has a plurality of layered fingers carrying the inner ends of the conductors. A pattern of contact bumps on the free ends of the fingers provides a co-planar pattern of conductor contacts which match a pattern of semiconductor device test pads. The fingers and contacts are formed by cutting kerfs between the conductors at the periphery of the centrally located opening.
Claims9
A method of manufacture for a test probe ring for contacting a test pad pattern on a semiconductor device, comprising the steps of
- applying a conductive ground plane layer to one side of an insulating layer,
- fabricating a plurality of separate adjacent conductors on the side opposing the one side of the insulating layer,
- forming an opening in the attached layers located so the adjacent conductors terminate at inner conductor ends at the periphery of the opening,
- attaching a substantially non-oxidizing conductor wire across the inner conductor ends of the plurality of conductors, and
- cutting a kerf between the inner ends of the adjacent conductors, whereby the conductors are electrically and mechanically separated into adjacent fingers and thereby carry a contact of a length of the conductor wire at the inner ends thereof in a pattern which registers with the test pad pattern.
Dependencies are inferred from the claim text.