Three-dimensional modular assembly of integrated circuits
AssigneeFairchild Space and Defense Corporation
InventorEarl R. Nicewarner, Jr.
Life of this patent
Estimating the term…
Abstract
An integrated circuit package that includes three base substrate support members. One base substrate support member is rigid and has two sides and the other two base substrate members are flexible and are located adjacent each side of the rigid base substrate support member. Each flexible base substrate support member has an inner surface and a series of flip chips are located between the inner surfaces of the flexible base substrate support members and the sides of the rigid base substrate support member. The three base substrate support members are electrically connected together and a termination connection is provided at one end of the assembly. In addition, logic chips are provided that are located adjacent the connector for controlling the various flip chips.
Claims6
An integrated circuit module assembly comprising a primary base substrate support member having two sides, two secondary base support members each having an inner and an outer side with one secondary base support member being located with the inner side thereof located adjacent to and in close proximity to one side of said primary base substrate support member and the other secondary base support member being located with the inner side thereof located adjacent to and in close proximity to the other side of said primary base substrate support member, at least one flip chip combination in a back to back relationship located between the inner side of said secondary base support members and the adjacent side of said primary base substrate support member, electrical connecting means for connecting at least one secondary base support member to said primary base substrate support member and wherein at least one of said base substrate support members is flexible.
Dependencies are inferred from the claim text.