Probe and electrical part/circuit inspecting apparatus as well as electrical part/circuit inspecting method

An apparatus for probing semiconductor devices having terminal comprising:

• a substrate (1) having a surface;
• probe electrodes (B) disposed on the surface of the substrate, wherein the electrodes are arranged on the surface of the substrate in a plurality of columns for probing the semiconductor device, each probing column extending outwardly from a central portion of the substrate surface towards a perimeter of the substrate surface;
• and
• means (6;
• S1-S10;
• S) for electrically coupling probe electrodes with a test system in such a way so as to provide the devices to be probed with a selection of more than two arrangements in which device terminals contacting the probe electrodes are not shorted with each other by the coupling means, wherein the coupling means includes a plurality of line patterns (6), each line electrically interconnecting the electrode of a respective one of the probing columns, wherein the probe electrodes are arrayed in a grid pattern at contacting regions with the device to be probed by a signal path switching means (S1-S10;
• S), and wherein said probe electrode and signal path switching means are both formed on the substrate.