Assembly for rapid and accurate testing of encapsulated devices
AssigneeTeledyne Industries, Inc.
InventorsNidal Kerdiya, Richard L. Andes
Life of this patent
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AssigneeTeledyne Industries, Inc.
InventorsNidal Kerdiya, Richard L. Andes
Estimating the term…
A relay test assembly constructed of a majority of parts adapted to be injection molded and capable of withstanding large and rapid swings in temperature and humidity. These include a central approximately cylindrical body portion having a plurality of channels running therethrough generally-parallel to the axis of the body portion. The channels provide easy entry to leads of a relay. Each channel includes a spring contact which may be brought to bear against a lead positioned in the channel to provide positive electrical contact to the lead so that connection may be made to sources of potential or current. A second set of contacts surrounds the first set and may be brought to bear against a lead positioned in the channel to provide a second more positive electrical contact to the lead closer to the relay through which testing may be conducted. A sleeve positioned about the body portion is shaped to move the springs into contact with the relay leads and retract the springs.
A test assembly for encapsulated electrical devices comprising
A test assembly for encapsulated electrical devices comprising
An encapsulated electrical device comprising
A test assembly for encapsulated electrical devices Comprising
Dependencies are inferred from the claim text.