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AssigneeDelco Electronics Corporation
InventorsScott D. Brandenburg, William S. Murphy, Ahmer R. Syed, David A. King, Shing Yeh
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A terminal pattern is provided for an integrated circuit device, such as a ball grid array package or an integrated circuit flip chip. The terminal pattern is composed of a number of terminals arranged in concentric arrays, each array having a substantially circular shape and being composed of a number of terminals. The terminal pattern is composed of at least two arrays, and more typically three or more arrays. When the integrated circuit device is mounted to its intended substrate, the individual terminals of the terminal pattern each register with and are soldered to a corresponding conductor of a conductor pattern formed on the substrate. A significant advantage is that, due to the terminals of the terminal pattern being arranged in concentric arrays, a smaller maximum width for the terminal pattern is achieved than possible with a conventional rectangular terminal pattern having the same number of terminals. As such, the terminal pattern and the resulting solder joints between the terminal pattern and its corresponding conductor pattern exhibit improved fatigue life as compared to the conventional rectangular terminal pattern.
A terminal pattern for an integrated circuit device, the terminal pattern comprising terminals arranged in concentric arrays, each array having a substantially circular shape and comprising a plurality of the terminals, the plurality of terminals being interconnected with conductors of a single layer conductor pattern such that the conductors extend radially outward relative to the terminal pattern, wherein the terminal pattern has a smaller maximum width than a rectangular terminal pattern for an integrated circuit device having the same number of terminals, whereby after soldering the integrated circuit device to the conductors to form solder joints therebetween with the terminals, the solder joints will exhibit reduced shear strain, resulting in improved fatigue life for the solder joints as compared to that possible for the rectangular terminal pattern.
A terminal pattern for a ball grid array package, the terminal pattern being formed on a surface of a daughter board of the ball grid array package, the terminal pattern comprising terminals arranged in concentric arrays, each array having a substantially circular shape and comprising a plurality of the terminals, the plurality of terminals being interconnected with conductors of a single layer conductor pattern such that the conductors extend radially outward relative to the terminal pattern, wherein the terminal pattern has a smaller maximum width than a rectangular terminal pattern for a ball grid array package having the same number of terminals, whereby after soldering the ball grid array package to the conductors to form solder joints therebetween with the terminals, the solder joints will exhibit reduced shear strain, resulting in improved fatigue life for the solder joints as compared to that possible for the rectangular terminal pattern.
A terminal pattern formed on a surface of an integrated circuit flip chip, the terminal pattern comprising terminals arranged in concentric arrays, each array having a substantially circular shape and comprising a plurality of the terminals, the plurality of terminals being interconnected with conductors of a single layer conductor pattern such that the conductors extend radially outward relative to the terminal pattern, wherein the terminal pattern has a smaller maximum width than a rectangular terminal pattern for an integrated circuit flip chip having the same number of terminals, whereby after soldering the integrated device to the conductors to form solder joints therebetween with the terminals, the solder joints will exhibit reduced shear strain, resulting in improved fatigue life for the solder joints as compared to that possible for the rectangular terminal pattern.
Dependencies are inferred from the claim text.