Low boiling point liquid coolant cooling structure for electronic circuit package
AssigneeNEC Corporation
InventorMinoru Yoshikawa
Life of this patent
Estimating the term…
Abstract
A cooling structure which is used for forced cooling of an electronic circuit package such as an integrated circuit is disclosed. The cooling structure comprises a tubular fin member having many through-holes of small diameter, a flat plate member which is joined to and seals one end of the tubular fin member, a lid member attached to the other end of the tubular fin member and a pipe member used as a nozzle from which coolant is jetted towards the plate member. Both the tubular fin member and the plate member are made of a material having high heat conductivity. The pipe member extends through the lid member or is inserted through an opening formed in the lid member. The electronic circuit package is fixed to the plate member.
Claims20
A cooling structure for cooling an electronic circuit package using liquid coolant having a low boiling point which can remove heat by vaporization of said liquid coolant, comprising:
- a tubular fin member made of a material having high heat conductivity and having a plurality of through-holes of small diameter formed therein;
- a flat plate member made of a material having high heat conductivity and having a pair of surfaces, a first one of said surfaces being joined to one end of said tubular fin member to close one end of said fin member, and a second one of said surfaces being capable of being affixed to the electronic circuit package;
- a lid member being attached to the other end of said fin member;
- and
- a pipe member extending through said lid member so that an outlet at one end thereof is located adjacent said first surface of said flat plate member;
- wherein the liquid coolant being supplied into said pipe member by way of the other end of said pipe member directly collides against said first surface of said flat plate member and is subsequently forced out through said through-holes in an evaporated state.
A cooling structure for use for cooling an electronic circuit package using liquid coolant having a low boiling point which can remove heat by vaporization of said liquid coolant, comprising:
- a tubular fin member made of a material having high heat conductivity and having a plurality of through-holes of small diameter formed therein;
- a flat plate member made of a material having high heat conductivity and having a pair of surfaces, a first one of said surfaces being joined to one end of said tubular fin member to close one end of said fin member, a second one of said surfaces being capable of being affixed to an electronic circuit package;
- a lid member being attached to the other end of said tubular fin member and having an opening therein;
- a liquid coolant supply member provided to supply the liquid coolant and constructed to allow the liquid coolant to circulate in the inside thereof;
- and
- a nozzle member mounted on said liquid coolant supply member and inserted through said opening for jetting the liquid coolant into the inside of said tubular fin member directly against said first surface of said flat plate member whereby the liquid coolant is subsequently forced out through said through-holes in an evaporated state.
Dependencies are inferred from the claim text.