US 5,491,362 A · Package structure having accessible chip

Abstract

A package for an integrated-circuit includes a package body having a die-cavity formed therein. A die-attach pad is formed in the package body adjacent the die-cavity. An opening is formed in the central portion of the die-attach pad for exposing one side of the integrated-circuit die so that an external cooling media can directly contact the exposed side of the integrated-circuit die. The die-attach pad can be formed as a die-mounting ring adjacent the die-attach cavity. The peripheral edge of the integrated-circuit die is fixed to a mounting surface on the die-mounting ring portion to accommodate direct cooling of the exposed side of the integrated-circuit die. The mounting surface of the die-mounting ring extends beyond the peripheral edge of the integrated-circuit die to accommodate a range of sizes of the integrated-circuit die. The exposed surface of the integrated circuit die is cooled, for example, with a cooling fluid, a heatsink, or a thermo-electric refrigeration unit in contact with the exposed side of the die. The exposed side of the die is coated with a film to provide a seal for the exposed side of the integrated-circuit die.

Claims15

Dependent claims

An integrated-circuit package assembly for an integrated-circuit die, comprising:

said integrated-circuit die having a first, front surface on which are formed wire-bonding pads, said integrated-circuit die having a second, back surface, wherein said second, back surface has a mounting area adjacent to a peripheral edge of said integrated-circuit die for mounting said integrated-circuit die;
a package body having a die cavity formed therein for receiving said integrated-circuit die, said package body having a ring portion formed therein adjacent to the die cavity, wherein said ring portion extends from said package body into the die cavity, wherein said ring portion includes a mounting surface to which the mounting area on said second, back surface, of said integrated-circuit die is fixed to provide exposure of the back side of said integrated-circuit die and to accommodate direct cooling of the exposed back side of the integrated-circuit die;
and
bonding wires connected between the wire-bonding pads on the front surface of the integrated circuit die and lead fingers of a leadframe for the integrated-circuit package assembly.

1 more element

A package structure having an accessible chip comprising:

an integrated-circuit die having front and back surfaces, said front surface having wire-bonding pads peripherally disposed thereon, said back surface having a mounting area peripherally located thereon,
a package body having a die cavity formed therein for receiving said integrated-circuit die, said package body having a ring portion formed therein adjacent to said die cavity, wherein said ring portion extends from said package body into said die cavity, said ring portion including a mounting surface to which said mounting area on said back surface of said integrated-circuit die is fixed such that said integrated-circuit die is secured within said die cavity in a die-down configuration with said back surface of said integrated-circuit die exposed thereby allowing direct cooling of said exposed back surface of said integrated-circuit die;
and
bonding wires connected between said wire-bonding pads peripherally located on said front surface of said integrated-circuit die and lead fingers of a leadframe for said integrated-circuit package assembly,

1 more element

Dependencies are inferred from the claim text.

Package structure having accessible chip

Life of this patent

Package structure having accessible chip

Life of this patent

Abstract

Claims15