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US 5,491,118 AGranted
Cadmium-free and lead-free thick film paste composition
AssigneeE. I. Du Pont de Nemours and Company
InventorJacob Hormadaly
Life of this patent
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Abstract
The invention is directed to a lead-free and cadmium-free thick film paste composition suitable for forming resistor or thermistor patterns on a substrate.
Claims9
A thick film paste composition suitable for forming resistor or thermistor patterns on a substrate comprising by weight %, basis solids (a) 5-65% wt. ruthenium-based conductive materials;
- (b) 95-35% wt. glass composition consisting essentially of by mole % 5-70% Bi.sub.2 O.sub.3, 18-35% SiO.sub.2, 0.1-40% CuO, 5-25% ZnO, 0.5-40% CoO, 0.5-40% Fe.sub.2 O.sub.3, and 0.5-40% MnO, wherein the glass composition is free of lead and cadmium;
- and, all of (a) and (b) dispersed in an organic medium.
A thick film paste composition suitable for forming resistor or thermistor patterns on a substrate comprising by weight % basis solids (a) 5-65% wt. ruthenium-based conductive materials;
- (b) 95-35% wt. glass composition consisting essentially of by mole % 0-2% MgO, 0-20% BaO, 0-6% Al.sub.2 O.sub.3, 0-45% B.sub.2 O.sub.3, 0-5% ZrO.sub.2, 18-35% SiO.sub.2, 5-70% Bi.sub.2 O.sub.3, 0-25% ZnO, 0.2-40% CuO, 0.1-40% CoO, 0.5-40% Fe.sub.2 O.sub.3, and 0.5-40% MnO, wherein the glass composition is free of lead and cadmium;
- and, all of (a) and (b) dispersed in an organic medium.
Dependencies are inferred from the claim text.