Metal semiconductor package with an external plastic seal
AssigneeIntegrated Packaging Assembly Corporation
InventorsGerald K. Fehr, Victor Batinovich
Life of this patent
Estimating the term…
Abstract
An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the semiconductor die. A metallic base is positioned at the bottom side of the lead frame. A metallic cap is positioned over the top side of the lead frame. The metallic cap includes a central aperture that is aligned with the semiconductor die. An external plastic seal is used to join the metallic base, lead frame, and metallic cap. The external plastic seal may be in the form of a perimeter seal or a body seal.
Claims13
A method of forming a semiconductor package, said method comprising the steps of:
- providing a lead frame with a top surface and a bottom surface;
- affixing a semiconductor die to said top surface of said lead frame;
- connecting bond wires between said semiconductor die and said lead frame;
- positioning a metallic base member adjacent to said bottom surface of said lead frame to allow an adhesive to directly couple said metallic base member to said bottom surface of said lead frame;
- placing a metallic cap member on top of said top surface of said lead frame to allow an adhesive to directly couple said metallic cap member to said top surface of said lead frame, said metallic cap member defining a cavity over said semiconductor die;
- and
- sealing, after said placing step, said lead frame between said metallic base member and said metallic cap member with an external plastic seal.
A method of forming a semiconductor package, said method comprising the steps of:
- providing a lead frame with a top surface and a bottom surface;
- affixing a semiconductor die to said top surface of said lead frame;
- connecting bond wires between said semiconductor die and said lead frame;
- positioning a metallic base member adjacent to said bottom surface of said lead frame, said metallic base member including a perimeter flange member with a through-hole;
- placing a metallic cap member on top of said top surface of said lead frame;
- and
- sealing said lead frame between said metallic base member and said metallic cap member with an external plastic seal.
A method of forming a semiconductor package, said method comprising the steps of:
- providing a lead frame with a top surface and a bottom surface;
- affixing a semiconductor die to said top surface of said lead frame;
- connecting bond wires between said semiconductor die and said lead frame;
- positioning a metallic base member adjacent to said bottom surface of said lead frame;
- placing a metallic cap member on top of said top surface of said lead frame, said metallic cap member including a perimeter flange member with a through-hole;
- and
- sealing said lead frame between said metallic base member and said metallic cap member with an external plastic seal.
Dependencies are inferred from the claim text.