High utilization sputtering target for cathode assembly

A method of fabricating a sputtering target for a cathode assembly comprising the steps of:

• providing a starting slug of target grade material;
• forging the slug to form a disk having a front sputtering face and a rear face opposite the sputtering face, the sputtering face and target material eroding during use to define a final sputtered face contour and a residual target thickness t measured from the rear face, and to form a hub projecting from the rear face of and integral with the disk and being adapted to be secured to the cathode assembly;
• the slug having an initial height to diameter ratio such that the flow lines developed in displaced target material during forging which turn upward from the disk into the hub are located at a depth of the target material measured from the rear face which minimizes the thickness t in a region adjacent the hub so as to maximize the amount of target grade material sputterable in the region before encountering the flow lines which turn upward from the disk into the hub;
• the method thereby reducing the labor and amount of scrap normally attendant the machining of a target having an integral hub from a single flat piece of material, increasing the utilization of the target grade material and providing a target having superior sputtering properties near the center of the target.

A sputtering target for a cathode assembly comprising:

• a disk machined from a first piece of target grade material and having a front sputtering face and a rear face opposite said sputtering face, said sputtering face and target material eroding during use to define a final sputtered face contour and a residual target thickness t measured from said rear face;
• a hub machined from a second piece of material for securement to said rear face and being adapted to be secured to the cathode assembly;
• securement means for securing said hub to said rear face, said securement means utilizing a depth of said target material measured from said rear face which minimizes the thickness t in a region adjacent said hub so as to maximize the amount of said target grade material sputterable in said region before encountering said securement means;
• said target thereby reducing the labor and amount of scrap normally attendant the machining of a target having an integral hub from a single piece of material, and increasing the utilization of said target grade material.

A method of fabricating a sputtering target for a cathode assembly comprising:

• providing a first piece of target grade material;
• machining a disk from the first piece of target grade material which has a front sputtering face and a rear face opposite the sputtering face, the sputtering face and target material eroding during use to define a final sputtered face contour and a residual target thickness t measured from the rear face;
• providing a second piece of material;
• machining a hub from the second piece of material for securement to the rear face of the disk which is adapted to be secured to be secured to the cathode assembly;
• securing the hub to the rear face with a securement means which utilizes a depth of target material measured from the rear face which minimizes the thickness t in a region adjacent the hub so as to maximize the amount of the target grade material sputterable in the region before encountering the securement means;
• the method thereby reducing the labor and amount of scrap normally attendant the machining of a target having an integral hub from a single piece of material, and increasing the utilization of the target grade material.