Direct bonding of copper composites to ceramics
AssigneeHughes Aircraft Company
InventorsAlvin L. Krum, William T. Campbell
Life of this patent
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Abstract
A ceramic member (52) is direct-bonded to a copper composite substrate (58) by heating to diffuse copper to the surface (56) of the copper composite substrate, oxidizing the surface of the copper composite substrate following heating, placing a ceramic member in contact with the resulting oxidized substrate, and forming a copper-copper oxide eutectic (54) at the interface between the copper composite substrate and the ceramic member by heating. The eutectic, upon cooling, forms a bond between the copper composite and the ceramic.
Claims10
A process for direct bonding a ceramic to a copper composite, said process comprising the steps of:
- heating a copper composite substrate to a first temperature at which copper diffuses to a region adjacent the surface of said substrate,
- oxidizing said substrate after heating,
- placing a ceramic member in contact with the resulting oxidized substrate in an inert atmosphere at a second temperature sufficient to produce a copper-copper oxide eutectic at the interface between said oxidized substrate and said ceramic member, said eutectic, upon cooling, forming a bond between said ceramic and said copper composite.
A process for direct bonding a ceramic member to a copper-tungsten substrate, said process comprising the steps of:
- heating a copper-tungsten substrate to a temperature of about 1200.degree. C.,
- oxidizing said substrate after heating,
- placing a ceramic member in contact with the resulting oxidized copper-tungsten substrate in an inert atmosphere at a temperature in the range of about 1065.degree. C. to 1083.degree. C. to produce a copper-copper oxide eutectic at the interface between said oxidized copper-tungsten substrate and said ceramic member,
- cooling to form a bond between said ceramic member and said copper-tungsten substrate.
Dependencies are inferred from the claim text.