IC chip test socket with double-ended spring biased contacts

A test socket for a multi-contact integrated circuit (IC) chip, comprising:

• a substrate,
• an array of double-ended spring contacts positively retained in said substrate, each spring contact comprising a hollow elongate body with an expanded midsection and a pair of contact heads extending out from opposite sides of the body, and a spring within said body biasing said contact heads to extend out from opposite respective sides of the substrate, said springs being held in compression between their respective contact heads and electrically connecting said contact heads, with said contact heads normally spring biased to maximum outward positions relative to said substrate and being moveable only inward into said substrate against the force of their respective springs, and
• a positioning structure on one side of said substrate for holding an IC chip with the chip's contacts aligned with the contact heads of respective spring contacts on that side of the substrate,
• said substrate including a plurality of openings, said spring contacts being lodged within respective ones of said openings with their expanded midsections press-fit in their respective openings to positively retain the spring contacts in place, said substrate comprising a pair of substrate laminations that have mutually aligned arrays of openings, with each spring contact lodged in a respective pair of aligned openings in each lamination with its expanded midsection press-fit into both lamination openings to secure said laminations together immediately adjacent each other without adhesive.

A test socket for a multi-contact integrated circuit (IC) chip, comprising:

• a substrate with an array of openings,
• a standoff on said substrate for elevating an IC chip above the substrate surface,
• an array of double-ended spring contacts having expanded midsections that are press-fit into respective openings of said substrate so as to be positively retained in said substrate, each spring contact having a pair of contact heads, and a spring biasing said contact heads to extend out from opposite respective sides of the substrate, said springs being held in compression between their respective contact heads and electrically connecting said contact heads, with said contact heads normally spring biased to maximum outward positions relative to said substrate and being moveable only inward into said substrate against the force of their respective springs, and
• a positioning structure on one side of said substrate for holding an IC chip with the chip's contacts aligned with the contact heads of respective spring contacts on that side of the substrate,
• said substrate comprising a pair of substrate laminations that have mutually aligned arrays of openings, with each spring contact lodged in a respective pair of aligned openings in each lamination with its expanded midsection press-fit into both lamination openings to secure said laminations together immediately adjacent each other without adhesive.

A test structure for a multi-contact integrated circuit (IC) chip, comprising:

• a) a circuit board having an array of contacts arranged in alignment with at least some of the contacts of said IC chip,
• b) a test socket for said IC chip, comprising:
• i) a substrate having an array of openings,
• ii) an array of double-ended spring contacts having expanded midsections that are press-fit into respective openings of said substrate so as to be positively retained in said substrate, each spring contact having a pair of electrically connected contact heads that are spring biased to extend out from opposite respective sides of the substrate, and
• iii) a positioning structure on one side of said substrate for holding an IC chip with the chip's contacts aligned with the contact heads of respective spring contacts on that side of the substrate, said positioning structure holding the IC chip relative to said substrate so that said contact heads are contacted and depressed by respective IC chip contacts when the IC chip is moved towards said substrate, said substrate comprising a pair of substrate laminations that have mutually aligned arrays of openings, with each spring contact lodged in a respective pair of aligned openings in each lamination with its expanded midsection press-fit into both lamination openings to secure said laminations together immediately adjacent each other without adhesive,
• c) means for mounting said test socket on said circuit board with the spring contact heads that are located on the opposite side of the substrate from the chip positioning structure contacting respective board contacts and being depressed by said circuit board contacts inward into said substrate against said spring bias,
• d) means for releasably clamping an IC chip in said positioning structure so that the chip's contacts bear against respective spring contact heads and depress said contact heads inward into said substrate against said spring bias with said contact springs electrically interconnecting the circuit board contacts with respective chip contacts, and
• e) an electrical interconnection network on said circuit board for applying test signals to and receiving response signals from said chip through said spring contacts.

A test structure for a multi-contact integrated circuit (IC) chip, comprising:

• a) a circuit board having an array of contacts arranged in alignment with at least some of the contacts of said IC chip,
• b) a test socket for said IC chip, comprising:
• i) a substrate with an array of openings,
• ii) an array of double-ended spring contacts having expanded midsections that are press-fit into respective openings of said substrate so as to be positively retained in said substrate, each spring contact having a pair of electrically connected contact heads that are spring biased to extend out from opposite respective sides of the substrate, said substrate comprising a pair of substrate laminations that have mutually aligned arrays of openings with each spring contact lodged in a respective pair of aligned openings in each lamination with its expanded midsection press-fit into both lamination openings to secure said laminations together immediately adjacent each other without adhesive, and
• iii) a positioning structure on one side of said substrate for holding an IC chip with the chip's contacts aligned with the contact heads of respective spring contacts on that side of the substrate, said chip positioning structure comprising a frame for said chip,
• c) means for mounting said test socket on said circuit board with the spring contact heads that are located on the opposite side of the substrate from the chip positioning structure contacting respective board contacts and being depressed by said circuit board contacts inward into said substrate against said spring bias,
• d) means for releasably clamping an IC chip in said positioning structure so that the chip's contacts bear against respective spring contact heads and depress said contact heads inward into said substrate against said spring bias with said contact springs electrically interconnecting the circuit board contacts with respective chips contacts, said releasable clamping means bearing against the outer surface of said IC chip to urge the chip into its frame and extending up from said circuit board to clamp the chip in its frame on the test socket, and
• e) an electrical interconnection network on said circuit board for applying test signals to and receiving response signals from said chip.

A test structure for a multi-contact integrated circuit (IC) chip, comprising:

• a) a circuit board having an array of contact arranged in alignment with at least some of the contacts of said IC chip,
• b) a test socket for said IC chip, comprising:
• i) a substrate,
• ii) an array of double-ended spring contacts positively retained in said substrate, each spring contact having a pair of electrically connected contact heads that are spring biased to extend out from opposite respective sides of the substrate, said substrate comprising a pair of substrate laminations that have mutually aligned arrays of openings, with each spring contact lodged in a respective pair of aligned openings in each lamination with its expanded midsection press-fit into both lamination openings to secure said laminations together immediately adjacent each other without adhesive, and
• iii) a positioning structure on one side of said substrate for holding an IC chip with the chip's contacts aligned with the contact heads of respective spring contacts on that side of the substrate,
• c) means for mounting said test socket on said circuit board with the spring contact heads that are located on the opposite side of the substrate from the chip positioning structure contacting respective board contacts and being depressed by said circuit board contacts inward into said substrate against said spring bias, said mounting means comprising a plurality of arms extending laterally outward from the test socket substrate, and bolts extending through said arms into corresponding openings in the circuit board,
• d) means for releasably clamping an IC chip in said positioning structure so that the chip's contacts bear against respective spring contact heads and depress said contact heads inward into said substrate against said spring bias with said contact springs electrically interconnecting the circuit board contacts with respective chips contacts, and
• e) an electrical interconnection network on said circuit board for applying test signals to and receiving response signals from said chip.

A multi-contact electrical interconnection structure for interconnecting a pair of devices that have an array of mutually aligned and opposed electrical contacts, comprising:

• first and second substrates having respective arrays of mutually aligned openings extending between opposed major surfaces of the substrates, said substrates positioned adjacent to each other along major surfaces, and
• an array of double-ended spring contacts retained in said substrate openings, said spring contacts each having a pair of spring biased contact heads that are electrically connected to each other and spring biased to extend out from opposite respective sides of said substrates, and respective hollow bodies from which said contact heads extend, said bodies each having a continuous expanded midsection that is press-fit into a respective pair of aligned openings in said substrates to positively retain the spring contacts in place and secure the substrates together immediately adjacent each other without adhesive, each of said spring contacts including a spring biasing its contact heads to extend out from opposite sides of said substrate, said springs being held in compression between their respective contact heads and electrically connecting said contact heads, with said contact heads normally spring biased to maximum outward positions relative to said substrates and being moveable only inward into said substrates against the force of their respective springs.