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US 5,489,752 AGranted
Process for dissipating heat from a semiconductor package
AssigneeSGS-Thomson Microelectronics S.A.
InventorsCarlo Cognetti, Michael J. Hundt
Life of this patent
Estimating the term…
Abstract
A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.
Claims9
A support for an integrated circuit, comprising:
- a printed circuit board having an upper and a lower surface;
- a dam on the upper surface defining a region;
- at least one aperture connecting the region with a location outside the region;
- a plurality of contact pads on the upper surface and located adjacent the dam;
- an integrated circuit device having a package resting on said dam, and having a plurality of conductive leads connected to said conductive pads;
- and
- a material filling the region and contacting the integrated circuit and the printed circuit board upper surface, wherein the material filling the region comprises a good thermal conductor.
4 more elements
A support for an integrated circuit, comprising:
- a printed circuit board having an upper and a lower surface;
- a dam on the upper surface defining a region;
- at least one aperture connecting the region with a location outside the region;
- a plurality of contact pads on the upper surface and located adjacent the dam;
- an integrated circuit device having a package resting on said dam, and having a plurality of conductive leads connected to said conductive pads;
- a material filling the region and contacting the integrated circuit and the printed circuit board upper surface;
- and
- at least one additional through hole extending from the enclosed region to a metallic conductor.
5 more elements
Dependencies are inferred from the claim text.