US 5,489,749 AGranted

Semiconductor connection components and method with releasable lead support

AssigneeTessera, Inc.

InventorsThomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew

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Abstract

A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

Claims12

Dependent claims

A method of making connections to a part of a semiconductor chip assembly comprising the steps of:

(a) juxtaposing a connection component with the chip so that a bottom surface of a support structure in said connection component confronts a front surface of a first part of such assembly having contacts on such surface, so that each contact on such front surface of such first part is aligned with a gap in such support structure and so that connection sections of leads on said connection component extending across such gap are disposed above said contacts, said support structure supporting each said connection section at both sides of each such gap during the juxtaposing step;
and
(b) bonding each said connection section to a contact on said first part by displacing such connection section downwardly into the gap so as to displace one end of each said connection section downwardly relative to the support structure and bring the connection section into engagement with such contact, said displacing step including the step of engaging each said connection section with a recess in a bonding tool and moving the bonding tool downwardly so that the bonding tool at least partially constrains the position of the connection section in lateral directions transverse to the downward movement of the bonding tool during said downward displacement, wherein said bonding step is performed so as to detach said one end of each said connection section from said support structure during said downward displacement.

A method of making connections to contacts on a front surface of a part of a semiconductor chip assembly comprising the steps of:

(a) juxtaposing a connection component with the part so that a bottom surface of a support structure in said connection component faces downwardly to the front surface of the part, and so that connection sections of a plurality of leads on said connection component extending from said support structure overly said contacts;
(b) aligning said connection component with said part to thereby crudely align said connection sections of said leads with said contacts;
and
(c) bonding said connection sections to said contacts on said part by engaging each said connection section with a recess in a bonding tool so that said bonding tool constrains the connection section into more precise alignment with the contact and displacing such bonding tool downwardly so as to force the connection section downwardly and bring the connection section into engagement with the aligned contact, said support structure supporting each said connection section at both ends until engagement with said bonding tool said bonding step being performed so as to detach said one end of each said connection section from said support structure during said downward displacement.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 08/268,040Filed 29 Jun 1994 · division
Priority: 24 Jul 1992
Granted: 6 Feb 1996
Term ends: Not estimatedThe source records don’t support an estimate.

Classification16 codes

H10W 70/453
Leadframes: comprising flexible metallic tapes
H10W 70/479
Leadframes: on or in insulating or insulated package substrates, interposers, or redistribution layers
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H10W 70/688
Characterised by their insulating layers or insulating parts: flexible insulating substrates