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US 5,489,641 AGranted
Freeze resistant die-attach compositions
AssigneeQuantum Materials, Inc.
InventorStephen M. Dershem
Life of this patent
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Abstract
In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid monomer vehicle comprising at least two monomers wherein at least one monomer is a polycyanate ester monomer, electrically conductive filler, and a curing catalyst. Compositions of the invention remain homogeneous at room temperature for at least eight hours.
Claims13
A composition for attaching a semiconductor device to a substrate comprising:
- 8 to 20 wt. percent monomer vehicle comprising at least two monomers, wherein at least one monomer is a polycyanate ester monomer, and wherein said monomer vehicle is free of solvent;
- 80 to 92 wt. percent electrically conductive filler;
- and
- 50 to 1500 ppm metal catalyst;
- wherein said monomer vehicle is liquid under ambient conditions.
2 more elements
A composition for attaching a semiconductor device to a substrate comprising:
- 13 to 20 wt. percent monomer vehicle comprising 1,1bis(4-cyanatophenyl)ethane(I) and 2,2-bis(4-cyanatophenyl)propane(II), wherein said monomer vehicle is free of solvent;
- 80 to 87 wt. percent silver filler;
- and
- 50 to 500 ppm cobalt acetylacetonate.
1 more element
Dependencies are inferred from the claim text.