Substrate having an optically transparent EMI/RFI shield
AssigneeMotorola, Inc.
InventorsThomas J. Swirbel, Reginald L. Barnes
Life of this patent
Estimating the term…
Abstract
A substrate having an optically transparent EMI/RFI shield. A transparent substrate (10) has a thin film metallization pattern (20) on one surface, and some of the pattern is covered with an optically transparent EMI/RFI shield (32). The shield comprises a vapor deposited layer of indium-tin oxide on the substrate surface and on the metallization pattern. The indium-tin oxide is optically transparent. It is patterned to expose one portion (34) of the metallization pattern and to cover a second portion (32) of the metallization pattern. The shield is electrically connected to a part (26) of the metallization pattern that is covered, thus providing electrical shielding and transparency.
Claims7
A substrate having an optically transparent EMI/RFI shield, comprising:
- a substrate having a thin film metallization pattern on a major surface;
- and
- an optically transparent EMI/RFI shield comprising a vapor deposited layer of indium-tin oxide on the substrate major surface and on the metallization pattern, the shield patterned to reveal a first portion of the metallization pattern and to cover a second portion of the metallization pattern.
A substrate for a flip-chip, having an optically transparent EMI/RFI shield, comprising:
- a substrate having a thin film metallization pattern on a major surface, the pattern comprising a layer of vapor deposited chrome on the substrate, a second layer of copper on the chrome, and a third layer of gold on the copper;
- an optically transparent EMI/RFI shield comprising;
- an indium-tin oxide layer vapor deposited on the substrate major surface and on a first portion of the metallization pattern;
- the indium-tin oxide layer electrically connected to the first portion of the metallization pattern;
- and
- the indium-tin oxide layer revealing a second portion of the metallization pattern;
- and
- an electronic device electrically attached to the second portion of the metallization pattern.
Dependencies are inferred from the claim text.