Heat resisting robot hand apparatus

Abstract

A heat resisting robot hand apparatus suitable for use within a highly-heated and pressure-reduced chamber in which radiant heat emitted from a heat stage and a material to be heated, such as a semiconductor wafer, is reflected and intercepted, and in which the heat from the material conducted to an arm section is reduced. The heat resisting robot hand apparatus includes a hand section supporting a material to be heated and a heat reflection plate reflecting radiant heat, parallel and adjacent to the portion of the hand section for supporting the material with an intervening gap. The heat reflection plate is supported on the hand section by heat-insulating supports with a gap for accommodating heat distortion. The hand section is connected to the arm section by heat-insulating fitting means with a heat-insulation space. Seats of the hand section contact the material independent of the hand section. Further, the heat reflection plate is cooled by cooling structure.

Dependencies are inferred from the claim text.