Device for conditioning polishing pads
AssigneeSpeedfam Corporation
InventorsJoseph V. Cesna, Anthony G. Van Woerkom
Life of this patent
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Abstract
A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.
Claims10
A process for simultaneously truing and dressing a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis which comprises while said polishing pad is being rotated bringing under pressure into contact with the top exposed surface of said polishing pad and oscillating over the said pad surface a carrier element adapted for vertical movement into and out of substantially perpendicular engagement with the surface of a polishing pad and for oscillating radial movement over the surface of the polishing pad, said carrier element being in the shape of a ring and carrying on its bottom surface cutting means disposed in a circular ring configuration for truing and dressing the polishing pad by contact therewith.
A device for simultaneously truing and dressing a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a carrier element adapted for vertical substantially perpendicular movement into and out of engagement with the surface of a polishing pad and for oscillating radial movement over the surface of the polishing pad, said carrier element having a ring-shaped flange downwardly depending from its bottom surface carrying cutting means for truing and dressing the polishing pad by contact therewith.
Dependencies are inferred from the claim text.