Integrated dynamic power dissipation control system for very large scale integrated (VLSI) chips

An apparatus including an integrated circuit chip, said apparatus comprising:

• chip logic including a functional state output;
• sensing means for measuring a temperature of said chip;
• clocking means having a clock output connected to said chip logic;
• and,
• power management means connected to said functional state output of said chip logic, to said clocking means and to said clocking means;
• said power management means including control means responsive to said sensing means and to said functional state output of said chip logic for generating a control signal to said clocking means;
• said clocking means including selecting means responsive to said control signal for changing an operating frequency of said clocking means, depending upon a state of said control signal;
• said selecting means including gate means at said clock output for inhibiting said clock output.

An apparatus including an integrated circuit chip, said apparatus comprising:

• a chip logic on said integrated circuit chip, said chip logic including a functional state output;
• a temperature sensing circuit having a temperature output signal;
• said temperature sensing circuit being located such that said temperature sensing circuit detects a temperature of said integrated circuit chip;
• a frequency modifying circuit having a clock output connected to said chip logic;
• a power management circuit connected to said functional state output of said chip logic and to said temperature output signal;
• and,
• a control signal connected between said power management circuit and said frequency modifying circuit;
• said power management circuit changing a state of said control signal in response to said temperature output signal and to said functional state output of said chip logic;
• said frequency modifying circuit including a frequency modifying circuit logic that changes an operating frequency of said frequency modifying circuit in response to said state of said control signal.

An integrated circuit chip comprising:

• a chip logic including a functional state output;
• a temperature sensing circuit;
• a frequency modifying circuit having a clock output connected to said chip logic;
• and,
• a power management circuit connected to said chip logic, to said temperature sensing circuit and to said frequency modifying circuit;
• said power management circuit including means responsive to said temperature output signal and to said functional state output of said chip logic for generating a control signal to said frequency, modifying circuit;
• said frequency modifying circuit including means responsive to said control signal for changing an operating frequency thereof, depending upon a state of said control signal;
• said means responsive to said control signal including a gate at an output of said frequency modifying circuit.

A method of controlling heat dissipation in an integrated circuit chip having chip logic thereon, said chip logic including a functional state output;

• a method comprising steps of:
• A. establishing a threshold temperature (T);
• B. sensing a temperature (t) of said chip;
• C. clocking said chip with an output of a frequency modifying circuit connected to said chip logic;
• and,
• D. modifying said output of said frequency modifying ,circuit in accordance with a predetermined relationship between said temperature (t) and said threshold temperature (T).

A method of controlling heat dissipation in an integrated circuit chip having chip logic thereon, said chip logic including a functional state output;

• a method comprising steps of:
• A. establishing a threshold temperature (T);
• B. sensing a temperature (t) of said chip;
• C. clocking said chip with an output of a frequency modifying circuit connected to said chip logic;
• D. modifying said output of said frequency modifying circuit in accordance with a predetermined relationship between said temperature (t) and said threshold temperature (T);
• and,
• E. preventing said output of said frequency modifying circuit from reaching said chip logic upon a condition that said temperature (t) is greater than said threshold temperature (T).