Method of forming multi-element thin hot film sensors on polyimide film
AssigneeThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration
InventorPurnell Hopson, Jr.
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Abstract
The invention comprises a method of forming a multi-element, thin hot film sensor on a polyimide film. The sensor is formed by first cleaning one surface of the polyimide. Then, under a continuous vacuum, the surface is simultaneously cleaned by ion bombardment while nickel is deposited by evaporation. The ion beam cleaning is discontinued and copper is then deposited to an initial thickness by evaporation without a break in the vacuum. The vacuum is then removed and a final thickness of copper is deposited by plating. Sensor patterns are then defined in the nickel and copper layers using conventional photolithography and etching techniques.
Claims7
A method of forming a multi-element thin hot film sensor on a polyimide film substrate comprising the steps of:
- cleaning a surface of the polyimide substrate;
- forming a first layer of nickel by evaporation on the cleaned polyimide surface and simultaneously bombarding the surface with an ion beam, wherein the simultaneous ion beam bombardment and nickel deposition are performed under a vacuum;
- forming a second layer, wherein the second layer is further comprised of an initial layer of copper deposited by evaporation in a vacuum on the first layer of nickel, and a remaining thickness of copper formed by electroplating, wherein the vacuum is continuous throughout deposition of both the nickel layer and the initial copper layer;
- defining a sensor pattern in the copper and nickel layers.
Dependencies are inferred from the claim text.