Laminated solid-state image pickup device

A laminated solid-state image pickup device comprising:

• a semiconductor circuit substrate, comprising accumulating portions for accumulating electric signals, and reading means for reading the electric signals;
• an insulating layer formed on said semiconductor circuit substrate except at at least parts of said accumulating portions;
• connecting members formed in contact with said accumulating portions;
• and
• a photoconductive film laminated on said insulating layer and said connecting members,
• wherein said photoconductive film comprises a non-crystalline semiconductor configured by laminating a carrier multiplication layer, a light absorbing layer, a charge injection inhibiting layer of a second conduction type, and
• wherein each of said connecting members comprises a first semiconductor region of a first conduction type, instrinsic or having a low impurity density, surrounded by a second semiconductor region of the second conduction type.