Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof

Process for producing circuitized ceramic greensheets while preventing warpage and distortion thereof, comprising the steps of:

• (a) forming a thin ceramic greensheet;
• (b) forming vias in said greensheet, either before or after step (f);
• (c) applying an ablatable release layer to the surface of a temporary rigid carrier support;
• (d) applying a thin non-ablatable, adhesive layer over said release layer;
• (e) forming a conductive patterned circuit layer by plating such layer over said adhesive layer;
• (f) lightly-laminating the thin ceramic greensheet of step (a) over said plated circuit layer;
• (g) applying conductive metal paste to fill the vias and to form interconnections with the patterned conductive circuit layer formed on the adhesive-coated surface of said carrier support to form a circuitized greensheet;
• and
• (h) ablating said release layer to separate said circuitized greensheet from said temporary rigid carrier support.