Method for mounting integrated circuits onto printed circuit boards and testing
AssigneeMicron Technology, Inc.
InventorDonald D. Baldwin
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.
Claims9
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB), the PCB having a plurality of bonding sites provided thereon, the IC device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the IC device is mounted to the PCB, the method comprising the following steps:
- providing a PCB having an upper surface;
- providing magnetic material within the IC device;
- inducing a magnetic field of a selected strength at the surface of the PCB to hold the IC device onto the PCB in such a manner that the conductive portions of the IC device are in alignment with the corresponding bonding sites;
- testing the PCB and IC device while the IC device is being held onto the PCB by the magnetic field;
- and
- after said testing, soldering the conductive bonding portions to the corresponding bonding sites of the PCB while the IC device is held onto the PCB by the magnetic field.
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB), the PCB having a plurality of bonding sites provided thereon, the IC device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the IC device is mounted to the PCB, the method comprising the following steps:
- providing a PCB having an upper surface;
- providing magnetic material within the IC device;
- moving the IC device to the PCB;
- aligning the conductive portions of the IC device with the corresponding bonding sites of the PCB;
- placing the conductive portions in contact with the corresponding bonding sites;
- inducing a magnetic field of a selected strength at the surface of the PCB to hold the IC device onto the PCB;
- testing the PCB and IC device while the IC device is being held onto the PCB by the magnetic field;
- and
- after said testing, soldering the conductive portions to the corresponding bonding sites of the PCB while the IC device is held onto the PCB by the magnetic field.
Dependencies are inferred from the claim text.