Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends
AssigneeStaktek Corporation
InventorCarmen D. Burns
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Abstract
The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.
Claims8
A high density integrated circuit module, comprising:
- an assembly of a plurality of stacked integrated circuit packages;
- some of said packages being provided with trifurcated distal lead ends extending from at least one side of each said package;
- and wherein said trifurcations of said lead ends from at least some adjacent integrated circuit devices are electrically connected.
A high density integrated circuit package, comprising:
- (a) an integrated circuit element;
- (b) a protective casing surrounding said integrated circuit element, said casing having an upper surface, a lower surface and four sides;
- (c) a plurality of electrical leads coupled to said integrated circuit element, said leads extending through one of said sides of said packages;
- and
- (d) wherein some of said leads are trifurcated at their distal end which extends from said package.
A rail-less bus system, comprising:
- (a) a high density integrated circuit module comprising a plurality of vertically stacked high density integrated circuit package;
- and
- (b) a plurality of external leads extending from each of said high density integrated circuit packages wherein some of said leads have a trifurcated distal lead end;
- wherein said trifurcated leads of adjacent said vertically stacked packages are electrically coupled.
Dependencies are inferred from the claim text.