High voltage thick film fuse assembly
AssigneeMepcopal Company
InventorJeffrey D. Montgomery
Life of this patent
Estimating the term…
Abstract
A thick film fuse assembly for high voltage, high amperage, high reliability applications. In a first embodiment the fuse assembly consists of an insulative substrate on which a parallel array of low mass thick film fusible elements are disposed. Thick film contact pads permit attachment of lead wires in electrical contact with the fusible elements. The fusible array is covered with a coating of arc suppressant glass. In a second embodiment of the fuse assembly, the fusible elements comprise thick film end portions and upstanding conductive wires which are positioned above and away from the insulative substrate. The arc suppressant glass surrounds each of the upstanding wires which permits higher amperage capacity.
Claims9
A fuse assembly comprising:
- a thermally and electrically insulative substrate, wherein said thermally and electrically insulative substrate comprises an alumina substrate having a dielectric coating of high melting temperature glass thereon;
- a plurality of parallel fusible conductive elements disposed on said insulative substrate, wherein said plurality of parallel fusible conductive elements comprise first and second thick film conductive fuse end portions disposed directly on said insulative substrate, the first and second thick film conductive fuse end portions each comprising a comb-like portion having a plurality of fingers extending towards the other while being electrically separate from the other, said plurality of parallel fusible conductive elements further comprise a plurality of thin conductive wires, wherein the plurality of thin conductive wires electrically bridge corresponding electrically separate fingers of the comb-like portions of the first and second thick film conductive fuse end portions, respectively;
- contact pads disposed on said substrate, said contact pads being in electrical contact with said plurality of fusible elements, wherein said contact pads comprise a first contact pad in electrical contact with the first thick film conductive fuse end portion and a second contact pad in electrical contact with the second thick film conductive fuse end portion;
- and
- a layer of low melting point arc suppressant glass covering said fusible elements,
- wherein, upon a clearing action, the plurality of thin conductive wires will migrate into the arc suppressant glass, and, if during the clearing action, the plurality of thin conductive wires should burn back to the corresponding fingers of the first and second thick film fuse conductive end portions, the first and second thick film fuse conductive end portions will also migrate into the arc suppressant glass.
A fuse assembly comprising:
- a thermally and electrically insulative substrate, wherein said thermally and electrically insulative substrate comprises an alumina substrate having a dielectric coating of high melting temperature glass thereon;
- a fusible conductive element comprised of a single gold wire connected in series with first and second thick film gold finger end portions, said gold wire and said first and second thick film finger end portions forming the fuse element, wherein said first and second thick film finger end portions each comprise a comb-like portion having a finger portion disposed directly on said insulative substrate, extending towards the other while being electrically separate from the other, and further wherein said gold wire electrically bridges said first and second thick film finger end portions;
- contact pads disposed on said substrate, said contact pads being in electrical contact with said fusible element, wherein said contact pads comprise a first contact pad in electrical contact with said first thick film finger end portion and a second contact pad in electrical contact with said second thick film finger end portion;
- and
- a layer of low melting point arc suppressant glass covering said fusible element,
- wherein, upon a clearing action, the gold wire will migrate into the arc suppressant glass, and, if during the clearing action, the gold wire should burn back to the first and second thick film finger end portions, the first and second thick film finger end portions will also migrate into the arc suppressant glass.
Dependencies are inferred from the claim text.