Semiconductor device with conductor clad insulator wiring
AssigneeNEC Corporation
InventorNoriaki Oda
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AssigneeNEC Corporation
InventorNoriaki Oda
Estimating the term…
A semiconductor device which comprises a first insulator, a first conductor disposed on one side near a semiconductor substrate, a second conductor disposed on the opposite side to the substrate forming a tubular member together with the first conductor, and a second insulator surrounding the member. The first insulator is incorporated into the member, and the member and the first insulator constitute an electrical wiring. Since the wiring is composed of the first insulator and the first and second conductors surrounding the first insulator, an electric current flows through the tubular member of the conductors. Therefore, when the device is operated by a high-frequency (for example 80 GHz or more) electric current, apparent increase of the wiring resistance due to the "skin effect" hardly occurs and as a result, reduction of the operating speed can be prevented.
A semiconductor device with a wiring, said wiring comprising an insulator, and a conductor formed so as to surround said insulator;
Dependencies are inferred from the claim text.