US 5,479,051 AGranted

Semiconductor device having a plurality of semiconductor chips

AssigneesFujitsu Limited, Kyushu Fujitsu Electronics Limited

InventorsMasaki Waki, Tosiyuki Honda, Yukio Gomi

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Abstract

A semiconductor device includes at least a first semiconductor chip and a second semiconductor chip each having a first surface and a second surface. The second surface of the first semiconductor chip confronts the first surface of the second semiconductor chip. Additionally, the semiconductor device includes a plurality of leads having inner portions and outer portions, where the inner portions of the leads are electrically coupled to selected portions on one of the first and second surfaces of each of the first and second semiconductor chips. An insulator is interposed between the second surface of the first semiconductor chip and the first surface of the second semiconductor chip at portions other than the selected portions. Further, a resin package encapsulates the first and second semiconductor chips so that the outer portions of the leads project outside the resin package.

Claims17

Dependent claims

A semiconductor device comprising:

a first semiconductor chip and a second semiconductor chip, each of said first and second semiconductor chips having a first surface and a second surface and respective first and second surface areas, the second surface of said first semiconductor chip confronting the first surface of said second semiconductor chip;
a plurality of leads having inner portions and outer portions, said inner portions of said leads being electrically coupled to corresponding, selected surface portions on one of the first and second surfaces of each of said first and second semiconductor chips;
an insulator, having first and second surfaces, interposed between the second surface of said first semiconductor chip and the first surface of said second semiconductor chip at portions other than the corresponding, selected surface portions thereof and so that each respective area of the first and second surfaces of said insulator overlaps said first semiconductor chip and overlaps said second semiconductor chip, and each respective area is smaller than the second surface area of said first semiconductor chip and smaller than the first surface area of said second semiconductor chip;
and
a resin package encapsulating said first and second semiconductor chips so that the outer portions of said leads project outside said resin package, said resin package including resin between the second surface of the first semiconductor chip and the first surface of the second semiconductor chip.

2 more elements

A semiconductor device comprising:

a first semiconductor chip and a second semiconductor chip, each of said first and second semiconductor chips having a first surface and a second surface, the second surface of said first semiconductor chip confronting the first surface of said second semiconductor chip;
a plurality of leads having inner portions and outer portions, said inner portions of said leads being electrically coupled to corresponding, selected surface portions on one of the first and second surfaces of each of said first and second semiconductor chips;
and
a resin package encapsulating said first and second semiconductor chips so that the outer portions of said leads project outside said resin package,
said inner portions of said leads being partially interposed between the second surface of said first semiconductor chip and the first surface of said second semiconductor chip so that a predetermined gap is formed between the second surface of said first semiconductor chip and the first surface of said second semiconductor chip;
said inner portions of said leads including:
first tape leads which are electrically coupled to the corresponding selected surface portions on the second surface of said first semiconductor chip;
second tape leads which are electrically coupled to the corresponding selected surface portions on the first surface of said second semiconductor chip;
and
lead frames at least partially interposed between the first and second tape leads and having ends which project from said resin package to form the outer portions.

7 more elements

Dependencies are inferred from the claim text.