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US 5,479,050 AGranted
Leadframe with pedestal
AssigneeTexas Instruments Incorporated
InventorsJames W. Pritchard, Dennis D. Davis
Life of this patent
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Abstract
A raised pedestal is formed on a leadframe die mount pad and is used in forming an electrical connection between the die bond pad and the semiconductor die, the electrical connection being isolated from the shear forces developed during temperature cycling or during thermal shock of the resultant semiconductor device. Such shear forces usually result in destruction of the bond between the semiconductor die and the die bond pad.
Claims4
The combination of a semiconductor die and a leadframe having a die mount pad thereon, comprising:
- a semiconductor die mounted on a metal die mount pad forming part of the leadframe;
- a self supporting contact area on die mount pad, formed from a part of the die mount pad raised above the semiconductor die;
- and
- a wire forming an electrical connection between the semiconductor die and said self supporting contact area on the die mount pad.
1 more element
Dependencies are inferred from the claim text.