US 5,478,965 AGranted

Fused chip-type solid electrolytic capacitor and fabrication method thereof

AssigneeNEC Corporation

InventorShiroh Hashiba

Life of this patent

Estimating the term…

Loading patent…

Abstract

A fused chip-type solid electrolytic capacitor in which a fuse is difficult to be cut and broken down during its fabrication sequence. The capacitor includes a capacitor element having an anode lead and a cathode layer, an anode terminal fixed to the anode lead, a fuse electrically connected to the cathode layer, a cathode terminal electrically connected to said cathode layer through said fuse; and a resin sheathing for entirely covering said capacitor element. The fuse is formed of a piece of a metallized plastic film and is mechanically bonded to the cathode terminal to the cathode layer by a first and second electrically conductive materials, respectively. The metallized plastic tape is preferably formed of a plastic base film and a metal layer deposited on the base film, and the metal layer is mechanically bonded to the cathode terminal by the first electrically conductive material and to the cathode layer by the second electrically conductive material.

Claims1

Dependent claims

A method of fabricating a fused chip-type solid electrolytic capacitor, comprising the steps of:

(a) forming a capacitor element having an anode lead and a cathode layer, said anode lead being implanted on a top of said element and said cathode layer being formed to cover a side face and a bottom of said element;
(b) fixing an anode terminal to said anode lead;
(c) mechanically bonding a fuse to said cathode layer;
said fuse being formed of a piece of a metallized plastic film, said metallized plastic film being formed of an electrically-insulating plastic base film and a metal layer deposited on a surface of said base film;
(d) trimming said metal layer of said fuse for adjusting its electric resistance;
(e) electrically connecting a cathode terminal through said fuse to said cathode layer;
said fuse being mechanically bonded to said cathode terminal by a first electrically conductive material and to said cathode layer by a second electrically conductive material;
said first and second electrically conductive materials having a melting temperature which is lower than a melting temperature of said metal layer;
said cathode terminal being electrically connected through said fuse to said cathode layer;
and
(f) forming a resin sheathing for entirely covering said capacitor element, said anode lead and said fuse and for partially covering said anode terminal and said cathode terminal;
said plastic base film of said fuse being in contact with said cathode layer;
and a bottom part of said cathode terminal being mechanically bonded and electrically connected to said metal layer by said first electrically conductive material;
and said second electrically conductive material being in contact with said cathode layer at an uncovered area of said cathode layer and with said metal layer of said fuse, so that said fuse is mechanically bonded and electrically connected to said cathode layer.

11 more elements

Dependencies are inferred from the claim text.