Polyoxymethylene composition and molded article thereof
AssigneePolyplastics Co., Ltd.
InventorsNoriyuki Sugiyama, Hiroko Iizuka
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Abstract
Polyoxymethylene compositions exhibiting improved heat stability and reduced formation of mold depositions during molding are usefully employed to form molded articles used as parts for electrical or electronic equipment since such parts experience few malfunctions due to formic acid generated from the composition. The preferred composition includes a blend of 100 parts by weight of polyoxymethylene resin with (a) 0.01 to 5.0 parts by weight of an antioxidant, (b) 0.01 to 5.0 parts by weight of a melamine-formaldehyde polycondensate, and (c) 0.001 to 10 parts by weight of at least one metallic compound selected from magnesium oxide, magnesium carbonate, and calcium oxide.
Claims6
A polyoxymethylene composition which comprises a blend of 100 parts by weight of a polyoxymethylene with:
- (a) 0.01 to 5.0 parts by weight of an antioxidant,
- (b) 0.01 to 5.0 parts by weight of a melamine-formaldehyde
- polycondensate, and
- (c) 0.001 to 10 parts by weight of at least one metallic compound selected from the group consisting of magnesium oxide, magnesium carbonate and calcium oxide.
Dependencies are inferred from the claim text.