Method for use of preflux, printed wiring board, and method for production thereof

A method for the production of a printed wiring board, comprising:

• (a) applying a preflux to a printed wiring board, said preflux being represented by the following general formula (1):
• ##STR13## wherein R.sub.1 stands for H or an alkyl group of one to 17 carbon atoms, R.sub.2 stands for H or an alkyl group of one to six carbon atoms, and n stands for an integer in the range between 0 and 3, or by the following general formula (2):
• ##STR14## wherein R.sub.3 stands for H or an alkyl group of one to six carbon atoms, R.sub.4 stands for H or an alkyl group of one to six carbon atoms, R.sub.5 stands for an alkyl group of zero to seven carbon atoms, and n stands for an integer in the range between 0 and 3, to a printed wiring board on which circuits have been formed;
• and
• (b) performing an oxidizing treatment on said printed wiring board.

A method for the production of a printed wiring board, comprising:

• (a) applying a preflux, said preflux being represented by the following general formula (1):
• ##STR17## wherein R.sub.1 stands for H or an alkyl group of one to 17 carbon atoms, R.sub.2 stands for H or an alkyl group of one to six carbon atoms, and n stands for an integer in the range between 0 and 3, or by the following general formula (2):
• ##STR18## wherein R.sub.3 stands for H or an alkyl group of one to six carbon atoms, R.sub.4 stands for H or an alkyl group of one to six carbon atoms, R.sub.5 stands for an alkyl group of zero to seven carbon atoms, and n stands for an integer in the range between 0 and 3, to a printed wiring board on which circuits have been formed;
• and
• (b) performing on said printed wiring board an oxidizing reflow treatment by application of heat in ambient air or an atmosphere of oxygen.