High-stability CMOS multi-port register file memory cell with column isolation and current-mirror row line driver
AssigneeExponential Technology, Inc.
InventorSiegfried Wiedmann
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AssigneeExponential Technology, Inc.
InventorSiegfried Wiedmann
Estimating the term…
A memory cell has the read current from the bit lines isolated from the bistable storage latch in the cell. Internal nodes of the bistable storage latch control isolated gates of MOS read transistors which gate the read current from the bit lines to a local node within the memory cell. The read current is then switched to ground from the local node by a read switch transistor. The read switch transistor is gated by the read row line. The read current is isolated from the read row line because the read row line is only connected to the isolated gate of the read switch transistor. The read current is also isolated from the bistable storage latch since the read transistors are connected at their isolated MOS gates to the bistable's nodes. This isolation of the read current allows additional read ports to be added without disrupting the cell's stability or write performance. The read ports are optimized independently of the bistable stability and write performance and even optimized independently of other read ports. For allowing better control of the read currents, a current-mirroring row driver causes the current in the row driver to be mirrored by the read currents flowing through the read switch transistors.
A multi-port memory comprising:
A multi-port memory comprising:
Dependencies are inferred from the claim text.
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Term ended 20 Mar 2015 (estimated)
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This invention relates to CMOS memory cells, and more particularly to a memory cell with multiple ports and isolation read transistors.
This application is related to "BiCMOS Static RAM with Active-Low Word Line", filed Aug. 31, 1994, U.S. Ser. No. 08/298,593, having a common inventor and assigned to the same assignee.
Random access memories (RAMs) have increased in speed and density at a rapid pace. Complementary metal-oxide-semiconductor (CMOS) devices have been used extensively in constructing arrays of memory storage cells. CMOS technology provides very high densities of memory cells using n-channel and p-channel MOS transistors.
FIG. 1 shows a typical prior-art 6-transistor cell.
FIG. 2 shows read ports isolated from the cell's storage latch.
FIG. 3 highlights the prior-art problem with read current flowing through row lines.
The present invention relates to an improvement in memory cells. The following description is presumed to enable one of ordinary skill in the art to make and use the invention as provided in the context of a particular application and its requirements. Various modifications to the preferred embodiment will be apparel to those with skill in the art, and the general principles defined herein may be applied to other embodiments. Therefore, the present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
FIG. 4 is a schematic diagram of a multi-port memory cell with current isolation. Cell 400 contains storage latch 302 composed of cross-coupled CMOS inverters. This storage latch 302 has two stable states and is sometimes referred to as a bistable. A first stable state occurs after a relatively high voltage is written to node 348 of storage latch 302, while a second stable state occurs after a relatively low voltage has been written to node 349 of storage latch 302. A low voltage applied to a bit line is often ground or a voltage transitioning toward ground, while a high voltage applied to a bit line can be 3.3 volts, or a transistor threshold below the power supply. Just a slight difference in the low and high voltages seen inside the cell at nodes 348, 349 is enough to change the state of the cell, especially when two bit lines with a voltage difference are applied to the bistable during a write. For clarity, one write port and two read ports are shown for cell 400 of FIG. 4, although the number of read and write ports can be varied.
Cell 400 can be broken down into several functional groups of transistors: