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AssigneeSony Corporation
InventorsThomas W. Goodman, Hiroyuki Fujita, Yoshikazu Murakami, Arthur T. Murphy
Estimating the term…
A method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed. It includes a process of forming a conductive layer on the surface of the terminal portion; a process of forming, on the surface of the connection portion, a conductive layer having a melting point different from that of the conductive layer formed on the surface of the terminal portion; and a process of melting the conductive layer having a low melting point in such a state that the conductive layer of the terminal portion is contacted with the conductive layer of the connection portion, thereby fusing the conductive layer having a low melting point onto the conductive layer having a high melting point. Moreover, the method includes a process of forming a projecting portion made of a heat-resisting material on the surface of the electronic part around the terminal portion, and forming a conductive layer at least one surface of the connection portion or the terminal portion; and a process of electrically connecting the connection portion with the terminal portion and allowing the projecting portion to be contacted with the surface of the board.
An electronic part mounting board comprising:
An electronic part mounting board comprising:
An electronic part mounting method for mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed, the method comprising the steps of:
An electronic part mounting board comprising:
An electronic part mounting board comprising:
An electronic part mounting method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed, comprising:
Dependencies are inferred from the claim text.