Process for producing the passivation layer of an active matrix substrate by back exposure

In a process for producing an actively addressing substrate which comprises

• placing a switching element composed of an opaque member, a transparent pixel electrode composed of a transparent member which is to be connected to said switching element, and two electrodes which supply said switching element with signals, thereby effecting on-off control of said switching element, which two electrodes are individually composed of an opaque member, on a transparent substrate so as to form a matrix,
• covering said element and said two electrodes with a passivation layer,
• applying a photoresist on said passivation layer,
• selectively exposing said photoresist to light,
• removing the light-exposed portion of the photoresist with a developer,
• removing the passivation layer in the portion in which the photoresist has been removed,
• removing the non-exposed portion of the photoresist, and
• leaving the passivation layer only in the portion corresponding to said non-exposed portion, an improvement wherein the above-mentioned selective exposure is exposure of said photoresist to light transmitted by said transparent member from the transparent substrate side, such that the light is blocked by said opaque members so as to selectively expose the photoresist, and wherein the passivation layer is left so as to cover an entirety of the opaque members.

A process for producing an actively addressing substrate which comprises

• placing (1) a switching element composed of an opaque member, (2) a wiring electrode having a first side and a second side, the first side of which is connected to said switching element, the wiring electrode being an opaque member, and (3) a transparent electrically conductive material having a first side and a second side, the first side of which electrically conductive material is connected to the second side of said wiring electrode and the second side of which electrically conductive material is to be connected to an external circuit, on a transparent substrate so as to form a matrix,
• covering said element, said electrode and said electrically conductive material with a passivation layer,
• applying a photoresist on said passivation layer,
• exposing said photoresist to light from the transparent substrate side, such that light passes through the transparent electrically conductive material and is blocked by the opaque members, so as to selectively expose the photoresist,
• removing the light-exposed portion of the photoresist with a developer,
• removing the passivation layer in the portion in which the said photoresist has been removed,
• removing the non-exposed portion of the photoresist, and
• leaving the passivation layer only in the portion corresponding to said non-exposed portion, the passivation layer being left so as to cover an entirety of the opaque members.