Method of forming developer through-holes in a print head

A method for forming developer through-holes in a print head which has a plurality of first electrodes and a plurality of second electrodes arranged in a matrix with an insulating layer sandwiched therebetween, and a main portion of each of the first electrodes is comprised of a pair of electrode sections disposed in parallel with each other at a specified gap width therebetween so as to define a gap section in each of said first electrodes, and a main portion of each of said second electrodes is comprised of a pair of electrode sections disposed in parallel with each other at a specified gap width therebetween so as to define a gap section in each of said second electrodes, and wherein the electrode sections of the main portions of said first electrodes extend along a first direction, and the electrode sections of the main portions of said second electrodes extend along a second direction which is non-parallel with the first direction such that said first and second electrodes and the gap sections of each of said first and second electrodes are positioned in a criss-crossed, spaced overlapping arrangement, and said method comprising:

• irradiating with laser light intersection portions of the gap sections in said first and second electrodes so as to form holes in the insulating layer, with each hole extending from an intersecting portion of the gap section in said first electrode, through the insulating layer, and to the intersection portion of a corresponding gap section in said second electrode so as to define the developer through-holes in said print head.