Test adapter for packaged integrated circuits

Abstract

A test clip, or test adapter, is provided for connecting leads of a tester to terminals on a packaged integrated circuit. Spacers on the test clip, which act to precisely separate the contact pins, are formed separately using a stamping process. Spacers may be formed having a thickness which can be controlled to approximately one mil. Each of the individual spacers is sandwiched between two contact pins to provide precise spacing of the contact pins. A bar is inserted through a hole in each of the spacers and contact pins to form a linear array of contact pins and spacers. Two or four (as appropriate) of the linear arrays of contact pins/spacers are then mounted on a test clip body sized for a specific integrated circuit package. Each of the spacers may include an L-shaped extension which is urged under the integrated circuit package when the test clip is pressed onto the package so as to firmly secure the test clip to the package.

Dependencies are inferred from the claim text.