Module test card
AssigneeFujitsu Limited
InventorDavid G. Love
Life of this patent
Estimating the term…
Abstract
Manufacturing of semiconductor devices is facilitated when the device chip carriers of the devices are tested, prior to population of chips thereon, by a module test card. The module test card is formed by a test substrate and a plurality of test chips mounted on the test substrate. Connections are provided on the test substrate for connecting to a tester. Through the module test card, the device chip carriers are tested under simulation of their operating conditions.
Claims23
In manufacturing semiconductor devices formed respectively by a plurality of chips and a carrier of the chips, a method for increasing production yield through refined testing methods, comprising the steps of:
- electrically coupling, prior to population of the chips thereon, the carrier to a module test card, said module test card having a test substrate and a plurality of test chips on the test substrate,
- electrically coupling said module test card to a tester,
- testing said carrier utilizing said module test card to generate test results, and
- comparing the test results with expected results to accept or reject the carrier.
An apparatus for testing a carrier of semiconductor chips prior to population of chips thereon to form a semiconductor device, comprising:
- a test substrate,
- a plurality of test chips coupled to the test substrate,
- means for temporarily electrically connecting a test substrate to said carrier, and
- means for electrically coupling the test substrate to a tester.
A method for testing a multi-chip module carrier on which a plurality integrated circuit chips are to be mounted, comprising the steps of:
- mounting a plurality of integrated circuit chips on a substrate, the integrated circuit chips on the substrate emulating the chips or a subset of the chips to be mounted on a carrier;
- establishing temporary electrical contact between the integrated circuit chips on the substrate and a carrier under test;
- establishing electrical contact between the integrated circuit chips on the substrate and a testing apparatus;
- applying input signals to the chips on the substrate from the testing apparatus;
- analyzing output signals from the chips on the substrate with the testing apparatus;
- and
- disconnecting the electrical contact between the integrated circuit chips on the substrate and the carrier.
Dependencies are inferred from the claim text.