Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits

A bonding structure between a first substrate made of a first material and a second substrate made of a second material, said first and second materials having different coefficients of thermal expansions, said first substrate having a first surface selectively formed thereon with a first metallization pattern constituting circuits and a second surface being bonded through a soldering agent to said second substrate;

• wherein said second surface of said first substrate has a second metallization pattern being selectively formed in a predetermined area thereon, said soldering agent being applied on said second metallization pattern to bond said first and second substrates with each other;
• and
• wherein said second metallization pattern comprises a plurality of almost rectangles aligned in matrix on said second surface of said first substrate.

A bonding structure between a dielectric substrate made of a dielectric material and a packaging substrate made of a heat conductive material involved in microwave integrated circuits, both said dielectric and heat conductive materials having different coefficients of thermal expansions, said dielectric substrate having a top surface formed thereon with a top metallization pattern constituting impedance matching circuits and a bottom surface being bonded through a soldering agent to said packaging substrate;

• wherein said bottom surface of said dielectric substrate has a bottom metallization pattern being selectively formed in a predetermined area thereon, said soldering agent being applied on said bottom metallization pattern to bond said dielectric and packaging substrates with each other;
• and
• wherein said bottom metallization pattern is the same as the top metallization pattern.

A bonding structure between a dielectric substrate made of a dielectric material and a packaging substrate made of a heat conductive material involved in microwave integrated circuits, both said dielectric and heat conductive materials having different coefficients of thermal expansions, said dielectric substrate having a top surface formed thereon with a top metallization pattern constituting impedance matching circuits and a bottom surface being bonded through a soldering agent to said packaging substrate;

• wherein said bottom surface of said dielectric substrate has a bottom metallization pattern being selectively formed in a predetermined area thereon, said soldering agent being applied on said bottom metallization pattern to bond said dielectric and packaging substrates with each other;
• and
• wherein said bottom metallization pattern comprises a plurality of almost rectangles aligned in matrix on said bottom surface of said dielectric substrate.