Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon

A microwave semiconductor device comprising:

• a package having an input terminal and an output terminal;
• a semiconductor chip, including an amplifier circuit having input and output sides and operative for amplifying input microwave signals supplied to said input side and producing corresponding, amplified microwave signals at said output side thereof;
• a chip carrier, said semiconductor chip being received on and affixed to said chip carrier and said chip carrier having an insulative collar member mounted thereon in surrounding relationship relative to said semiconductor chip as received on and affixed to said chip carrier, said chip carrier being disposed on and affixed to said package at a position between said input and output terminals thereof;
• an input matching circuit, provided in said package and operatively connected between said input terminal thereof and said input side of said semiconductor chip, for carrying out impedance matching at said input side of said amplifier circuit;
• an output matching circuit, provided in said package and operatively connected between said output side of said semiconductor chip and said output terminal of said package, for carrying out impedance matching at said output side of said amplifier circuit;
• and
• said chip carrier being provided between said input matching circuit and said output matching circuit in said package.

A chip carrier for a semiconductor chip, the chip having upper and lower main surfaces defining a specified thickness of the chip therebetween and a specified lateral configuration and size, comprising:

• a conductive holder having a main surface including a chip mounting surface portion, of substantially the same said lateral configuration and size of the chip, for mounting the semiconductor chip thereon, a peripheral surface portion surrounding the mounting surface portion, and outer wall surfaces substantially transverse to the mounting and peripheral surfaces thereof;
• and
• an insulative collar member having upper and lower surfaces and inner and outer wall surfaces transverse to the upper and lower surfaces, the lower surface being disposed on and affixed to the peripheral surface portion of the holder, the outer wall surfaces corresponding to and being substantially aligned with the corresponding outer wall surfaces of the holder, and the inner wall surfaces surrounding the mounting surface portion and defining therewithin a recess of a depth, measured from the mounting surface portion of the main surface of the holder, and of a lateral configuration and size, for substantially receiving therein and thereby positioning said semiconductor chip on said mounting surface portion or said conductive holder and with the lower surface of the chip below the upper surface of the insulative collar member and with the upper surface of the chip no lower than the upper surface of the insulative collar member.