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US 5,477,080 AGranted
Tape carrier and tape carrier device using the same
AssigneesMitsui Mining & Smelting Co., Ltd., Sharp Kabushiki Kaisha
InventorsMasaharu Ishisaka, Takeshi Nou, Naoyuki Tajima
Life of this patent
Estimating the term…
Abstract
A tape carrier comprises an insulating film and a pattern formed of a metal foil on at least one side surface of said film, said tape carrier being characterized in that an adhesive resin overcoat is applied to the pattern surface portion around a portion to be coated with an IC sealing resin, and a polyimide resin-based overcoat is applied to the remaining pattern surface portion.
Claims15
A tape carrier device comprising:
- (i) a tape carrier comprising an insulating film, a pattern formed of a metal foil on at least one side surface of said film, a polyimide resin-based overcoat and an adhesive resin overcoat, said adhesive resin overcoat being made of a resinous material other than the resinous material of the polyimide resin-based overcoat, said adhesive resin overcoat being applied to a pattern surface portion around the periphery of a portion to be coated with an IC sealing resin, and said polyimide resin-based overcoat being applied to the remaining pattern surface portion;
- (ii) an IC connected to the pattern formed on the tape carrier;
- and
- (iii) the IC sealing resin which seals the IC.
1 more element
A tape carrier device comprising:
- (i) a tape carrier comprising an insulating film, a pattern formed of a metal foil on at least one side surface of said film, a polyimide resin-based overcoat and an adhesive resin overcoat, said adhesive resin overcoat being made of a resinous material other than the resinous material of the polyimide resin-based overcoat, said polyimide resin-based overcoat being applied to the pattern surface portion except for that portion around the periphery of a portion to be coated with an IC sealing resin, and said adhesive resin overcoat being applied around the periphery of the portion of the area coated with the polyimide resin-based overcoat;
- (ii) an IC connected to the pattern formed on the tape carrier;
- and
- (iii) the IC sealing resin which seals in the IC.
1 more element
Dependencies are inferred from the claim text.