Semiconductor structure and method of manufacture

A method for manufacturing a semiconductor structure, comprising the steps of:

• providing a circuit board substrate, the steps for forming the circuit board substrate comprising:
• providing a support structure having a first surface and at least one contact pad;
• forming a first layer of resist over the first surface and the at least one contact pad;
• forming at least one opening through the first layer of resist, the at least one opening having a longitudinal axis that makes an acute angle with the first surface;
• filling the at least one opening with a conductive material;
• and
• removing at least a portion of the first layer of resist adjacent the conductive material, wherein the conductive material serves as a probe and the support structure serves as the circuit board substrate;
• providing a semiconductor chip support structure;
• replaceably mounting a semiconductor chip to the semiconductor chip support structure, wherein solder is absent between the at least one semiconductor chip and the semiconductor chip support and the semiconductor chip has a bonding pad on a surface;
• and
• mating the circuit board substrate to the support structure, wherein the probe contacts the bonding pad.