Method of growing epitaxial layers

A method of manufacturing a semiconductor device having an active layer sandwiched by a pair of graded layers, comprising steps of:

• exposing a selected one of a (311)A surface and a (311)B surface on a substrate of gallium arsenide;
• growing a first graded layer of gallium aluminum arsenide by a metal-organic molecular beam epitaxy while changing the temperature of the substrate;
• growing the active layer on the first graded layer;
• and
• growing a second graded layer of gallium aluminum arsenide on the active layer by the metal-organic molecular beam epitaxy while changing the temperature of the substrate.

A method of growing an epitaxial layer, including therein a plurality of regions having respective conductivity types which are different from each other, epitaxially on a common substrate, comprising the steps of:

• forming at least a first crystal surface and a second crystal surface, which are crystallographically non-equivalent to each other, on the substrate;
• introducing particles comprising constituent elements of the epitaxial layers in the vicinity of the substrate, the particles comprising at least metal-organic molecules containing one of the elements constituting the epitaxial layers;
• decomposing the metal-organic molecules such that the elements therein are released as a result of the decomposition;
• depositing the elements released by the decomposition of the metal-organic molecules onto said first and second crystal surfaces while controlling the vapor pressure of one of the elements at a first pressure level to form a first epitaxial layer covering the substrate including said first and second crystal surfaces, said first epitaxial layer including first and second regions in correspondence to said first and second crystal surfaces, said first and second regions having respective conductivity types determined by said first pressure level;
• and
• further depositing the elements, released by the decomposition of the metal-organic molecules, onto said first epitaxial layer while controlling the vapor pressure of said one of said elements at a second, different pressure level to form a second epitaxial layer, said second epitaxial layer including first and second regions in correspondence to said first and second regions of the first epitaxial layer, said first and second regions of said second epitaxial layer having respective conductivity types determined by said second pressure level, said second pressure level being set such that the conductivity type of at least one of the first and second regions of the second epitaxial layer is different from that of the corresponding region of the first epitaxial layer, the step of depositing being performed such that the growth of the first and second epitaxial layers is controlled by the decomposition of the metal-organic molecules.

A method of manufacturing a laser diode, comprising the steps of:

• defining a stripe-like region in a part of a substrate of gallium arsenide bounded by a (100) surface such that the stripe-like region exposes a (311)A surface of gallium arsenide;
• growing a first semiconductor layer comprising a first buffer region and a pair of second buffer regions, said step of growing the first semiconductor layer comprising the simultaneous steps of:
• growing said first buffer region of p-type gallium arsenide on said stripe-like region of the substrate by performing a first metal-organic molecular beam epitaxy for depositing at least gallium, arsenic and an n-type dopant under a vapor pressure of arsenic set at a first predetermined level, and
• growing said pair of second buffer regions of n-type gallium arsenide on corresponding, remaining parts of the substrate excluding the stripe-like region such that the second buffer regions sandwich the first buffer region laterally in the first semiconductor layer, said step of growing said pair of second buffer regions being performed simultaneously with the step of growing the first buffer region by performing the first metal-organic molecular beam epitaxy under an identical condition to that of the step of growing the first buffer region;
• growing a second semiconductor layer comprising a first clad region and a pair of second clad regions, said step of growing the second semiconductor layer comprising the simultaneous steps of:
• growing said first clad region of p-type gallium aluminum arsenide having a composition AlxGal-xAs with a compositional parameter x at a first value x1 on the first semiconductor layer in correspondence to the first buffer region by performing a second metal-organic molecular beam epitaxy for depositing aluminum, gallium, arsenic and an n-type dopant while setting the vapor pressure of arsenic to the first predetermined level,
• growing said pair of second clad regions of n-type gallium aluminum arsenide having a composition identical to said first clad region on said first semiconductor layer in correspondence to the second buffer regions such that said second clad regions sandwich said first clad region laterally in said second semiconductor layer, said step of growing the second clad regions being performed simultaneously with the step of growing the first clad region by performing the second metal-organic molecular beam epitaxy under an identical condition to that of the step of growing the first clad region;
• growing a third semiconductor layer comprising an active region and a pair of third clad regions on said second semiconductor layer, said step of growing said third semiconductor layer comprising the simultaneous steps of:
• growing said active region of p-type gallium aluminum arsenide having a composition AlxGal-xAs with the compositional parameter x at a second value x2 smaller than said first value x1 on said first clad region by performing said second metal-organic molecular beam epitaxy,
• growing said pair of third clad regions of p-type gallium aluminum arsenide having a composition AlxGal-xAs with the compositional parameter set to a third value x3 which is larger than the second value x2 on said pair of second clad regions, respectively, such that said third clad regions sandwich said active region laterally in said third semiconductor layer, said step of growing said third clad regions being performed simultaneously with said step of growing said active region by performing said second metal-organic molecular beam epitaxy under a condition identical to said step of growing said active region;
• and
• growing a fourth semiconductor layer of n-type gallium aluminum arsenide having a composition identical to that of said first clad region so as to cover said active layer and said third clad regions by performing said second metal-organic molecular beam epitaxy while setting the vapor pressure of arsenic to a second predetermined level.

A method of growing a semiconductor layer epitaxially on a common substrate, said epitaxial layer including therein a plurality of regions having respective compositions and conductivity types which are different from each other, said method comprising the steps of:

• forming at least a first crystal surface and a second crystal surface, which are crystallographically nonequivalent to each other, on said substrate;
• introducing particles comprising constituent elements of the epitaxial layers in the vicinity of the substrate, the particles comprising at least metal-organic molecules containing one of the constituent elements of the epitaxial layers;
• decomposing the metal-organic molecules such that the elements therein are released as a result of the decomposition;
• and
• depositing the elements released by the decomposition of the metal-organic molecules onto said first and second crystal surfaces while controlling the temperature of the substrate and the vapor pressure of one of the released elements respectively at a first temperature and a first vapor pressure to form a first epitaxial layer, said first epitaxial layer having a first region corresponding to said first crystal surface and a second region corresponding to said second crystal surface, said first region and said second region of said first epitaxial layer having respective compositions and conductivity types determined by said first temperature and first vapor pressure;
• further depositing the elements released by the decomposition of the metal-organic molecules onto said first epitaxial layer while controlling the temperature of the substrate and the vapor pressure of said one element respectively at a second temperature and a second vapor pressure to form a second epitaxial layer, said second epitaxial layer having a first region corresponding to said first region of the first epitaxial layer and a second region corresponding to said second region of the first epitaxial layer, said first and second regions of said second epitaxial layer having respective compositions and conductivity types determined by said second temperature and said second vapor pressure, said second temperature and second vapor pressure being chosen such that both the composition and the conductivity type of at least one of the first and second regions of the second epitaxial layer are different from those of the corresponding region of the first epitaxial layer, the steps of depositing and further depositing both being performed such that the growth of each of the respective first and second epitaxial layers is controlled by the decomposition of the metal-organic molecules.

A method of controlling the respective compositions of gallium aluminum arsenide layers grown epitaxially and in succession on a selected crystal surface of a gallium arsenide substrate, comprising the steps of:

• selecting one of a (311)A crystal surface and a (311)B crystal surface of the gallium arsenide substrate as the selected crystal surface thereof;
• introducing particles comprising at least metal-organic molecules containing aluminum and gallium, constituent elements of the gallium aluminum arsenide layers to be epitaxially grown, in the vicinity of the substrate;
• decomposing the metal-organic molecules of said particles such that aluminum and gallium elements therein are released as a result of the decomposition;
• depositing the released aluminum and gallium elements on the selected crystal surface of the substrate;
• and
• controlling the temperature of the substrate during the step of depositing in accordance with:
• defining, relatively to the selected crystal surface of the substrate, a first temperature at which the released and deposited aluminum and gallium elements form an epitaxial layer of a first composition and a second temperature, different from that the first temperature, at which the released and deposited aluminum and gallium elements form an epitaxial layer of a second composition, different from the first composition,
• setting the temperature of the substrate to the first temperature for a first time duration of the depositing step thereby to form a first epitaxial layer having the first composition, and
• setting the temperature of the substrate to the second temperature for a second time duration of the depositing step thereby to form a second epitaxial layer having the second composition.

A method of growing an epitaxial layer, including therein first and second regions having respective and different first and second compositions, epitaxially on a common substrate, comprising the steps of:

• forming at least a first crystal surface and a second crystal surface, which are crystallographically non-equivalent to each other, on said substrate;
• introducing particles comprising constituent elements of the epitaxial layer in the vicinity of the substrate, the particles comprising at least metal-organic molecules containing one of the elements constituting the epitaxial layer and the composition of the epitaxial layer comprising first and second elements of the same group of the periodic table;
• decomposing the metal-organic molecules such that the constituent elements therein are released as a result of the decomposition;
• and
• depositing the elements released by the decomposition of the metal-organic molecules onto said first and second crystal surfaces to form said epitaxial layer, said epitaxial layer having first and second regions respectively corresponding to said first and second crystal surfaces, said step of deposition further comprising:
• defining a first temperature of the substrate at which the released and deposited elements form an epitaxial layer on the substrate having a first, common composition in the first and second regions thereof and, further, defining a second temperature of the substrate at which the released and deposited elements form an epitaxial layer on the substrate in which the first and second regions of the epitaxial layer have the respective and different first and second compositions, the ratio of the proportionate content of the first and second elements of the same group of the periodic table being different in the first composition from that in the second composition, and
• controlling the substrate to the second temperature so that the first and second regions of the epitaxial layer, as formed on the first and second crystal surfaces of the substrate, have the respective and different first and second compositions, the step of depositing being performed such that the growth of the epitaxial layer is controlled by the decomposition of the metal-organic molecules.

A method of controlling the respective conductivity types of gallium aluminum arsenide layers grown epitaxially and in succession on a selected, exposed surface of a gallium arsenide substrate, comprising the steps of:

• providing a selected crystal surface of the substrate which will support the growth thereon of an epitaxial layer;
• introducing particles comprising constituent elements of the epitaxial layers in the vicinity of the substrate, said particles comprising at least metal-organic molecules containing one of the elements constituting each of the epitaxial layers;
• introducing molecules of a common dopant of the epitaxial layers in the vicinity of the substrate;
• decomposing the metal-organic molecules such that the constituent elements therein are released as a result of the decomposition;
• and
• depositing the elements released by the decomposition of the metal-organic molecules and the common dopant onto the selected crystal surface of the substrate, said step of depositing further comprising:
• defining first and second different vapor pressures of a first element, of the constituent elements, at which the released constituent elements, as deposited with the common dopant onto the selected crystal surface of the substrate, form corresponding first and second epitaxial layers on the selected crystal surface of the substrate of respective and different first and second conductivity types,
• selectively controlling the vapor pressure of the first element to the first pressure level for a first time duration of the depositing step so as to produce, as an epitaxial layer grown on the selected crystal surface, the first epitaxial layer doped with said common dopant and having the first conductivity type, and
• selectively controlling the vapor pressure of the first element to the second pressure level for a second time duration of the depositing step so as to produce, as an epitaxial layer grown on the first epitaxial layer, the second epitaxial layer doped with said dopant and having the second conductivity type.

A method of growing, on a substrate, an epitaxial layer having a selectively controlled conductivity type, comprising the steps of:

• selecting a crystal surface of the substrate which will support the growth thereon of an epitaxial layer;
• introducing particles comprising constituent elements of the epitaxial layer in the vicinity of the substrate, said particles comprising at least metal-organic molecules containing one of the elements constituting the epitaxial layer;
• decomposing the metal-organic molecules such that the elements therein are released as a result of the decomposition;
• and
• depositing the elements released by the decomposition of the metal-organic molecules onto the selected crystal surface of the substrate, said step of depositing further comprising selectively controlling the vapor pressure of a selected one of the first elements so as to produce a desired one of first and second, opposite conductivity types of the epitaxial layer as grown on the selected crystal surface, said step of selectively controlling the vapor pressure further comprising:
• defining, for the crystal surface, corresponding first and second vapor pressures in accordance with which the epitaxial layer as grown on the selected crystal surface is of the desired one of the first and second conductivity types, and
• during the step of depositing and for the desired one of the first and second different conductivity types of the epitaxial layer to be deposited on the selected crystal surface, maintaining the vapor pressure of the selected one of the elements at the corresponding one of the first and second vapor pressures.