Flame retardant epoxy molding compound, method and encapsulated device
AssigneeThe Dexter Corporation
InventorAnthony A. Gallo
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Abstract
A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the resin or the hardener), and an oxidizing refractory metal oxide, preferably on oxidizing metal oxide of an element selected from the Group VIA of the Periodic Table. The flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have synergistic flame retardant properties.
Claims34
A method for encapsulating a semiconductor device, said method comprising the steps of:
- (1) heating a thermosetting epoxy molding compound to a liquid state, and
- (2) encapsulating a semiconductor device with said thermosetting epoxy molding compound heated to a liquid state, and
- (3) cooling said encapsulated semiconductor device wherein said epoxy molding comprises:
- (a) about 5-25 percent by weight of compound of an epoxy;
- (b) about 4-20 percent by weight of compound of a resin hardener;
- (c) an effective amount of a catalyst for the reaction between said epoxy resin and said hardener in an amount of from about 0.1 to 10% by weight of the combined weight of epoxy and hardener;
- (d) an effective amount of a mold release agent for the release of the cured molding compound from a mold in an amount of between about 0.01 and about 2 percent by weight of compound;
- (e) between about 50 and 85 percent by weight of compound of a filler;
- and
- (f) a flame retardant system of:
- (1) a refractory metal oxide;
- (2) a reactive organic compound containing halogen, said reactive organic compound being a separate compound or being contained in one or more of said components (a)-(e) of said epoxy molding compound.
Dependencies are inferred from the claim text.