Electrical overstress pulse protection
AssigneeG & H Technology, Inc.
InventorHugh M. Hyatt
Life of this patent
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Abstract
An electrical overstress protection composite of electrical conductor/semiconductor particles including particles in the 100 to 10 micron range, micron range, and submicron range, distributed in a densely packed homogeneous manner, a minimum proportion of 100 angstrom range insulative particles separating the conductor/semiconductor particles, and a minimum proportion of insulative binder matrix sufficient to combine said particles into a stable coherent body.
Claims21
An electrical overstress protection composite comprising from about 55 to about 80% by volume of the composite of conductive/semiconductive particles, wherein the conductive particles are substantially free of surface insulation films or coatings, from about 20 to about 45% by volume of the composite of insulative material including up to several percent of insulative particles in the 100 angstrom range and sufficient insulative matrix material to bind the composite into a fixed coherent body, and said composite having a density within a few percent of the theoretical density for the materials and proportions employed, wherein the particle sizes of said conductive/semiconductive particles are distributed from a larger size of between about a 100 micron range to about a 10 micron range, down to a smaller size in the submicron range, and include intermediate sized particles in at least the micron size range, the composite being responsive to a high voltage electrical overstress pulse to switch from a high resistance to a low resistance substantially instanteously and to clamp said pulse at a low voltage value.
An electrical overstress protection composite comprising primarily conductive/semiconductive particles distributed in particle size from a larger size of between about the 100 and about the 10 micron range, down to a smaller size in the submicron range, and including intermediate sized particles in at least the micron size range, wherein the conductive particles are substantially free of surface insulation films or coatings, further including from about 1 to about 5% by volume of the composite of electrically insulative particles in the 100 angstrom range, and an electrically insulative binder matrix in sufficient quantity to bind the particles into a fixed coherent composite body.
Dependencies are inferred from the claim text.