US 5,476,566 A · Method for thinning a semiconductor wafer

Abstract

Advances in wafer technology and packaging have led to an increase in wafer size while requiring a decrease in wafer thickness. Thickness limitations increase as wafer diameter increases. Thinning a wafer past a certain limit can result in wafer breakage. A laminated semiconductor wafer structure (10) is assembled to provide mechanical support for the wafer. A semiconductor wafer (12) is affixed to a UV transparent support substrate (16) with a double-sided adhesive tape (14). The tape has dissimilar adhesives on its two sides. The first side has a UV curable adhesive (22) that adheres to the active surface of the wafer. The second side has a non-UV curable adhesive (24) which adheres to the UV transparent support substrate. This laminated structure can be used during a wafer thinning process and any subsequent handling. The support substrate and the tape are removed from the wafer by exposing the laminated structure to UV radiation.

Claims15

Dependent claims

A method for thinning a semiconductor wafer comprising the steps of:

providing a semiconductor wafer having an active surface and an inactive surface;
providing a portable and rigid support substrate, the substrate being a polymer;
affixing the active surface of the semiconductor wafer to the support substrate using a double-sided adhesive tape, wherein only one side contains a UV curable adhesive, to form a laminated structure;
backgrinding the inactive surface of the semiconductor wafer to a desired thickness to produce a thinned semiconductor wafer having a backlapped surface, wherein the thinned semiconductor wafer remains laminated to and is supported by the portable and rigid support substrate;
mounting the backlapped surface of the thinned semiconductor wafer to a dicing tape;
and
removing the portable and rigid support substrate from the thinned semiconductor wafer after the step of mounting by exposing the UV curable adhesive tape to UV radiation, leaving the thinned semiconductor wafer mounted to the dicing tape.

4 more elements

A method for thinning a semiconductor wafer comprising the steps of:

providing a semiconductor wafer having an active surface and an inactive surface;
providing a double-sided adhesive tape having a first side with a UV curable adhesive and a second side having a non-UV curable adhesive;
providing a portable and rigid UV transparent support substrate, the substrate being a polymer;
affixing the first side of the double-sided adhesive tape to the active surface of the semiconductor wafer;
affixing the second side of the double-sided adhesive tape to the portable and rigid UV transparent support substrate;
backgrinding the inactive surface of the semiconductor wafer to a desired thickness to produce a thinned semiconductor wafer having a backlapped surface, wherein the thinned semiconductor wafer is supported by the rigid UV transparent support substrate;
mounting the backlapped surface of the thinned semiconductor wafer to a dicing tape;
irradiating the dicing tape, the thinned semiconductor wafer, the double-sided adhesive tape, and the rigid UV transparent support substrate with UV light after the step of mounting;
and
removing the rigid UV transparent support substrate and the double-sided adhesive tape from the thinned semiconductor wafer, leaving the thinned semiconductor wafer mounted to the dicing tape.

7 more elements

Dependencies are inferred from the claim text.

Method for thinning a semiconductor wafer

Life of this patent

Method for thinning a semiconductor wafer

Life of this patent

Abstract

Claims15